| Controlled chemical decapsulation | Yes | Yes | Yes | B p.1 / C p.1 / T p.1 |
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| Acid delivery modes | Pulse Etch and Vortex Etch, user selectable | Pulse Etch and Vortex Etch, user selectable | Pulse Etch and Vortex Etch, user selectable | B p.12 / C p.2 / T p.2 |
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| Mixed-acid recipes | Yes — nitric:sulfuric and sulfuric:nitric 6:1, 5:1, 4:1, 3:1 | Yes — nitric:sulfuric and sulfuric:nitric 6:1, 5:1, 4:1, 3:1 | Yes — nitric:sulfuric and sulfuric:nitric 6:1, 5:1, 4:1, 3:1 | B p.12 / C p.2 / T p.2 |
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| Recipe storage | 100 user-defined programs in nonvolatile memory | 100 user-defined programs in nonvolatile memory | 100 user-defined programs in nonvolatile memory | B p.12 / C p.2 / T p.2 |
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| Etch time range | 1–1800 s in 1-second increments | 1–1800 s in 1-second increments | 1–1800 s in 1-second increments | B p.12 / C p.2 / T p.2 |
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| Post-etch rinse options | Nitric acid, sulfuric acid or no rinse | Nitric acid, sulfuric acid or no rinse | Nitric acid, sulfuric acid or no rinse | B p.12 / C p.2 / T p.2 |
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| Bias-voltage capability | No | 0.0–20 V in 0.1 V increments | 0.0–20 V in 0.1 V increments | L (JetEtch Pro) / C p.2 / T p.2 |
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| Sub-ambient etchant cooling | No | No | Yes | L |
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| Nitric acid temperature range | 20–90 °C | 20–90 °C | 10–90 °C | B p.12 / C p.2 / T p.2 |
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| Mixed-acid temperature range | 20–100 °C | 20–100 °C | 10–100 °C | B p.12 / C p.2 / T p.2 |
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| Etchant volume | 1.0–10.0 mL/min, software selectable | 1.0–10.0 mL/min, software selectable | 1.0–10.0 mL/min, software selectable | B p.12 / C p.2 / T p.2 |
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| Heat-up time | 0–120 s, user selectable | 0–120 s, user selectable | 0–120 s, user selectable | B p.12 / C p.2 / T p.2 |
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| Reservoirs | 500 mL or 1 litre; 4 bottles (2 acid, 2 waste) | 500 mL or 1 litre; 4 bottles (2 acid, 2 waste) | 500 mL or 1 litre; 4 bottles (2 acid, 2 waste) | B p.12 / C p.2 / T p.2 |
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| Certifications | CE, SEMI S-2-93, SEMI S-2-2000 | CE, SEMI S-2-93, SEMI S-2-2000 | CE, SEMI S-2-93, SEMI S-2-2000 | B p.12 / C p.2 / T p.2 |
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| Standard accessories | Basic Kit supplied with each system | Basic Kit supplied with each system | Basic Kit supplied with each system | B p.12 / C p.2 / T p.2 |
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| Optional accessory kits | DIP/SIP, QFP, QFN/MLP, PLCC, PBGA, SOIC, Die-down BGA, Universal | DIP/SIP, QFP, QFN/MLP, PLCC, PBGA, SOIC, Die-down BGA, Universal | DIP/SIP, QFP, QFN/MLP, PLCC, PBGA, SOIC, Die-down BGA, Universal | B p.12 / C p.2 / T p.2 |
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| Facility requirements | Chemical fume hood required; 0.5 m/s minimum flow (100 surface ft/min) | Chemical fume hood required; 0.5 m/s minimum flow (100 surface ft/min) | Chemical fume hood required; 0.5 m/s minimum flow (100 surface ft/min) | B p.12 / C p.2 / T p.2 |
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| Power | 350 W at 95–130 VAC or 210–250 VAC | 350 W at 95–130 VAC or 210–250 VAC | 350 W at 95–130 VAC or 210–250 VAC | B p.12 / C p.2 / T p.2 |
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| System dimensions (etcher unit) | 290 h × 290 w × 419 d mm | 290 h × 290 w × 419 d mm | 290 h × 290 w × 419 d mm | B p.12 / C p.2 / T p.2 |
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| System weight | 17 kg (38 lb), excluding bottle container and accessories | 17 kg (38 lb), excluding bottle container and accessories | 17 kg (38 lb), excluding bottle container and accessories | B p.12 / C p.2 / T p.2 |
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| Warranty | 12 months parts and labour; 5 years on the micrometering pump | 12 months parts and labour; 5 years on the micrometering pump | 12 months parts and labour; 5 years on the micrometering pump | B p.12 / C p.2 / T p.2 |
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| Daisy-chained recipes | No | No | No | S |
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| Recommended application profile | Gold and aluminium wire; routine failure analysis, construction analysis and counterfeit detection | Silver wire and thick copper or CuPd wire | Ultra-thin copper wire and high wire-count devices | S |
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