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Welcome!

Welcome to Nisene Technology Group, Inc., the innovators of advanced integrated circuit decapsulation systems used in the failure analysis of encapsulated integrated circuits. Our market-leading automated wet chemistry JetEtch systems are now complemented by our new PlasmaEtch microwave-induced plasma systems that address today’s leading-edge packaging and materials.

Our proprietary PlasmaEtch MIP system delivers a safe and reliable etch for all material types with no need for ultrasonic cleaning, which can damage bond structures. See slider below and under our “PlasmaEtch” product link.

Latest News

Feel free to visit us on social media at  Facebook, LinkedIn, or our YouTube Channel for decapsulation videos.

Features Include:

  • Patented Pump 
  • Robust Heat Exchanger 
  • Safety Features 
  • Advanced Software 
  • Ease-of-Use 
  • Next-generation Technology 
  • Affordable 
  • Industry-leading Warranty 
  • Click here for full specs 
  • Click here to view the product brochure 
JetEtch Pro Product Shot

Testimonials

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