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Welcome to Nisene Technology Group, Inc., the innovators of advanced integrated circuit decapsulation systems used in the failure analysis of encapsulated integrated circuits. Our market-leading automated wet chemistry JetEtch systems are now complemented by our new PlasmaEtch microwave-induced plasma systems that address today’s leading-edge packaging and materials.

Our proprietary PlasmaEtch MIP system delivers a safe and reliable etch for all material types with no need for ultrasonic cleaning, which can damage bond structures. See slider below and under our “PlasmaEtch” product link.

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Feel free to visit us on social media at  Facebook, LinkedIn, or our YouTube Channel for decapsulation videos.

Features Include:

  • Patented Pump 
  • Robust Heat Exchanger 
  • Safety Features 
  • Advanced Software 
  • Ease-of-Use 
  • Next-generation Technology 
  • Affordable 
  • Industry-leading Warranty 
  • Click here for full specs 
  • Click here to view the product brochure 
JetEtch Pro Product Shot


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