Welcome!

Welcome to Nisene Technology Group, Inc., the innovators of advanced integrated circuit decapsulation systems used in the failure analysis of encapsulated integrated circuits. Our market-leading automated wet chemistry JetEtch systems are now complemented by our new PlasmaEtch microwave-induced plasma systems that address today’s leading-edge packaging and materials.

Our proprietary PlasmaEtch MIP system delivers a safe and reliable etch for all material types with no need for ultrasonic cleaning, which can damage bond structures. See slider below and under our “PlasmaEtch” product link.

Latest News

  • ISO Certification Copper Wire 04

    ISO Cu Wire Preservation

    Nisene first saw copper bond wires almost 10 years ago. They were like a unicorn…a mythical creature created from the hysteria surrounding rapidly rising costs for gold. While the cost of gold has historically increased and decreased, the switch to copper metal bonding actually created a technological advantage, so much so that it solidified copper’s […]

  • decapsulation-example-copper-wire-sot-223-02

    Copper Wire Decap for SOT-223 Device!

    Today we etched a SOT-223 device and protected the sensitive copper wires inside. Have a look! Feel free to click on the photo to view the full-size version: Wow! Even though we are using nitric and sulfuric acids, the JetEtch Pro CuProtect is quite capable of preserving the wires. Using nothing more than a very […]

  • decapsulation-example-backing-gasket-bga-48-02

    BGA Decapsulation with Monolithic Gasket and Custom Backer

    Today we decapsulated a BGA that was very stubborn to etch. After a few iterations of nitric-only and mixed-acid etches with nitric and sulfuric that didn’t seem to penetrate the encapsulant, we decided to give it a shot with a higher temperature sulfuric acid etch. The JetEtch Pro rose to the occasion with an absolutely […]

  • Multiple Sample Etching in PlasmaEtch

    Multiple Sample Etching in PlasmaEtch

    Did you know that multiple samples can be processed at the same time in the Nisene PlasmaEtch? Because we have a 20x20mm effective decap zone, if multiple samples can fit in the 20x20mm one, they can all be decapped at the same time. Take for example the sample in Figure 1. This EXAR sample is […]

  • Metal Lift Example from Ultrasonic Bath

    Effects of Excessive Ultrasonic Processing

    It has long been an industry practice of post-decap cleaning an integrated circuit via ultrasonic. This process is done for multiple reasons. Decapsulation done through wet-chemical processing, like the JetEtch, can result in residue on the surface of the die and bond wires. While this residue doesn’t necessarily need to be removed, it can inhibit visual inspection. It is […]

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