NISENE TECHNOLOGY GROUP
Mechanical package opening

Controlled opening of selected hermetic semiconductor packages.

Nisene mechanical package-opening tools are intended for selected package constructions that cannot be opened through conventional mold-compound decapsulation. The product family includes tools for metal can-style devices and hermetically sealed ceramic dual-inline packages.

Package construction, material, dimensions, lid geometry, internal clearance, opening objective and tool compatibility must be reviewed before processing.
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Two tools for distinct hermetic package constructions

Metal can packages

CAN OPENER

Mechanical opening of selected metal can-style devices.

The Nisene Can Opener is intended to remove or separate the metal enclosure of compatible can-style semiconductor devices so that the internal die and package structures can be examined.

Potential purposes

  • Semiconductor failure analysis
  • Construction analysis
  • Counterfeit-component investigation
  • Incoming quality investigation
  • Reliability and qualification analysis
  • Examination of selected hermetic devices
Compatibility depends on package geometry, enclosure material, seam construction, internal clearance and the required opening method.
Discuss the Can Opener
Ceramic dual-inline packages

CERDIP OPENER

Mechanical lid separation for selected CERDIP packages.

The Nisene CERDIP Opener is intended to separate the ceramic lid from compatible hermetically sealed ceramic dual-inline packages for examination of the die and internal package structures.

Potential purposes

  • Semiconductor failure analysis
  • Construction analysis
  • Counterfeit-component investigation
  • Incoming quality investigation
  • Reliability and qualification analysis
  • Examination of selected hermetic ceramic packages
Compatibility depends on package dimensions, ceramic construction, lid geometry, seal arrangement, internal clearance and the condition of the package.
Discuss the CERDIP Opener

When chemical or dry encapsulant removal is not the applicable method

Metal and ceramic hermetic enclosures do not use the same mold-compound construction as many plastic semiconductor packages. Selected devices may therefore require controlled mechanical opening rather than chemical removal of an organic encapsulant.

The correct method depends on the package material, enclosure geometry, seal construction, internal clearance and examination objective.

Mechanical package opening may deform the enclosure, generate fragments or damage internal structures when the package, tooling or procedure is unsuitable. Compatibility must be reviewed before processing.

Select the tool according to the package construction

Metal can-style enclosure

The Can Opener may be evaluated for selected semiconductor devices enclosed within compatible metal can constructions.

Hermetic CERDIP construction

The CERDIP Opener may be evaluated for selected ceramic dual-inline packages with a mechanically separable lid construction.

Unknown package construction

The package should be identified and reviewed before selecting a mechanical, chemical, plasma or laser opening route.

Fragile or high-value samples

For irreplaceable, damaged, corroded or unusually constructed samples, Nisene applications engineering should review the package before any opening attempt.

Final tool selection depends on package material, dimensions, lid or seam construction, lead geometry, internal clearance, sample condition and analysis objective.

Can Opener for selected metal-enclosed devices

The Can Opener is intended to provide controlled mechanical access to compatible can-style semiconductor packages whose metal enclosure cannot be removed through conventional mold-compound decapsulation.

The tool and opening method must be matched to the device geometry and seam construction. Package support must not be inferred solely from the external appearance of the can.

Potential review factors

  • Can diameter or external dimensions
  • Enclosure material
  • Seam or closure geometry
  • Package height
  • Lead arrangement
  • Internal component clearance
  • Required opening location
  • Sample condition
Supported can styles, dimensions, fixtures and opening geometry remain subject to engineering confirmation.

CERDIP Opener for selected ceramic dual-inline packages

The CERDIP Opener is intended to separate the lid from compatible hermetically sealed ceramic dual-inline packages using a controlled mechanical arrangement.

Package dimensions, ceramic condition, lid construction, seal geometry and the position of internal structures must be reviewed before processing.

Potential review factors

  • Package body dimensions
  • Package thickness
  • Lid dimensions
  • Ceramic condition
  • Seal construction
  • Lead count and lead arrangement
  • Internal die and wire clearance
  • Required opening objective
Supported CERDIP sizes, blade configuration, vertical adjustment and opening procedure remain subject to engineering confirmation.

Designed for controlled package-specific setup

Capability descriptions only. No operating instructions, adjustment sequences or blade-placement guidance are published.

Package-specific positioning

The package must be positioned according to its construction and the approved tool arrangement.

Controlled enclosure engagement

The opening components engage the applicable lid, seam or enclosure area according to the approved method.

Adjustable setup

Tool position and sample setup may be adjustable according to the supplied product configuration.

Replaceable tooling

Blades, engagement components or package-contact elements may require inspection or replacement according to approved service documentation.

Bench-top operation

The tools are intended for use on a stable laboratory work surface, subject to current installation requirements.

Sample visibility

The operator must be able to inspect package position and tool engagement before applying the opening action.

Repeatable alignment

Approved setup references support repeatable positioning of compatible package types.

Applications-engineering support

Nisene can review unfamiliar package constructions and advise whether a mechanical opening route should be evaluated.

Package-specific review before opening

Package identification

Confirm the package family, manufacturer designation where available, dimensions and construction.

Enclosure or lid material

Identify whether the relevant enclosure is metal, ceramic or another material.

Seam or seal construction

Review the closure geometry and determine whether the package construction is mechanically separable.

Internal-clearance assessment

Consider the expected location of the die, wires, leads and other internal structures.

Tool and blade selection

The applicable tool, blade or engagement component must be selected from current approved documentation.

Sample-condition review

Cracked, corroded, previously processed or mechanically damaged samples require additional review.

The external package appearance alone is not sufficient to confirm compatibility.

From package review to examination

Step 1

Identify the package

Confirm package family, construction, materials, dimensions and examination objective.

Step 2

Confirm mechanical suitability

Nisene applications engineering or trained laboratory personnel review whether mechanical opening is appropriate.

Step 3

Select the approved tool and setup

Select the applicable Can Opener or CERDIP Opener configuration and approved package-contact components.

Step 4

Position and inspect the package

Position the sample according to approved documentation and verify alignment and internal-clearance considerations.

Step 5

Perform the controlled opening

Open the package only in accordance with the equipment manual, approved tooling and laboratory safety procedures.

Step 6

Inspect and document

Remove loose fragments according to approved procedures and examine the package, die and internal structures.

Mechanical package opening must be carried out only by trained personnel using approved tooling, eye protection, fragment-control measures, stable workholding and site procedures. Sharp components, brittle ceramic, metal fragments and package leads may present injury and contamination hazards.

Technical specifications

Published specifications are shown below.

Specification Can Opener CERDIP Opener
Intended package family Selected metal can-style semiconductor devices, subject to engineering review Selected hermetically sealed ceramic dual-inline packages, subject to engineering review
Opening method Mechanical package opening, subject to engineering review Mechanical package opening, subject to engineering review

Compare the mechanical package-opening tools

Can Opener

Package category
Selected metal can-style devices
Primary objective
Access through a compatible metal enclosure or seam
Key review factors
  • Can geometry
  • Seam construction
  • Enclosure material
  • Internal clearance
  • Required opening location
Discuss a Can Opener application

CERDIP Opener

Package category
Selected hermetically sealed ceramic dual-inline packages
Primary objective
Controlled separation of a compatible ceramic lid
Key review factors
  • Package dimensions
  • Ceramic condition
  • Lid geometry
  • Seal construction
  • Internal clearance
Discuss a CERDIP application
Tool selection and package compatibility must be confirmed before processing.

Select the appropriate package-opening method

Chemical decapsulation

JetEtch configurations

JetEtch configurations use controlled chemical processing for defined-area package decapsulation.

Explore chemical decapsulation
Plasma decapsulation

PlasmaEtch PE-1000

PlasmaEtch PE-1000 uses microwave-induced plasma under vacuum for dry package decapsulation.

Explore PlasmaEtch PE-1000
Laser decapsulation

LaserEtch LE-1064

LaserEtch LE-1064 uses controlled laser ablation for cavity development, bulk material removal and approved pre-cavitation workflows.

Explore LaserEtch LE-1064
Mechanical opening

Mechanical package opening

Nisene mechanical tools are intended for selected metal can and ceramic hermetic package constructions.

You are viewing Mechanical Package Opening
Method selection must be confirmed with Nisene applications engineering.

Application-specific compatibility review

Metal package categories

Round metal can Oval metal can Rectangular metal enclosure Flanged metal package Leaded metal package Custom metal enclosure Package construction unknown

Ceramic package categories

CERDIP Side-brazed ceramic DIP Ceramic package with sealed lid Legacy hermetic ceramic package Custom ceramic package Package construction unknown

Sample condition

New sample Field-return sample Corroded package Cracked ceramic Previously processed sample Mechanically damaged sample High-value or irreplaceable sample

Compatibility depends on package construction, dimensions, material, seam or seal geometry, internal clearance, sample condition, available tooling and examination objective.

No package category should be represented as supported until reviewed against the current tool configuration.

Review representative mechanical-opening results

Representative results. Contact Nisene for application examples relevant to your packages.

Prepare the laboratory workspace

Workspace requirements depend on the supplied configuration. Contact Nisene.

Stable work surface

The tool must be installed or positioned on a stable work surface according to current product documentation.

Lighting and visual inspection

Adequate lighting and inspection capability are required to verify package position and tool engagement.

Fragment and sharp-object control

The laboratory must control ceramic fragments, metal edges, sharp blades and package leads.

Tool storage and inspection

Blades, engagement components and package-contact tooling must be stored and inspected according to approved documentation.

Sample documentation area

The laboratory should provide an appropriate area for package identification, photography and post-opening examination.

Final workspace, mounting, guarding and safety requirements depend on the supplied tool configuration and customer site procedures.

Request installation information

Safety is part of the process

Operating responsibility

The Nisene Can Opener and CERDIP Opener must be used only by trained personnel with suitable workholding, eye protection, fragment-control measures and laboratory procedures. Customers are responsible for site-specific risk assessment, sharp-object control, ceramic-fragment control, sample handling and compliance with applicable workplace requirements.

Applicable safety, installation and operating documentation will be identified for the quoted tool configuration and supplied where applicable.

Support throughout the tool lifecycle

Applications engineering

Package review, tool-selection support and compatibility assessment for unfamiliar or challenging hermetic packages.

Installation and training

Available in accordance with the quotation, tool configuration and applicable territory.

Service and repair

Inspection, diagnosis and repair for supported mechanical package-opening tools.

Replacement blades and tooling

Replacement blades, engagement components, package-contact tooling and related parts subject to current availability.

Applications support Service and repair Submit an RMA

Mechanical package-opening information

Product information is published on the website.

Product information

Can Opener and CERDIP Opener

Review the systems, applications and operating scope on this page.

View product information
Support

Tooling, fixtures and spare parts

View supported tooling and service categories.

View support information

Discuss your mechanical package-opening application

Tell us about the package construction, material, dimensions, condition and examination objective. Nisene will review whether the Can Opener, CERDIP Opener or another package-opening method should be evaluated.

Nisene Technology Group
Based in Watsonville, California, USA.
417A Salinas Road, Watsonville, CA 95076, USA
sales@nisene.com
service@nisene.com
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Send an enquiry

Tell us the system, the package type and what you need to achieve, and our applications team will respond.

Email sales@nisene.com Service and RMA

Nisene Technology Group, 417A Salinas Road, Watsonville, CA 95076, USA