LASERETCH LE-1064
LaserEtch LE-1064 is designed to remove selected semiconductor package encapsulant using a controlled laser-ablation process. It may be evaluated for cavity development, bulk material removal and pre-cavitation before a subsequent chemical, plasma or other approved package-opening process.
LaserEtch LE-1064 uses controlled laser ablation to remove selected bulk encapsulant and develop a defined cavity over a semiconductor package.
Depending on the package construction and analysis objective, laser processing may be evaluated as a standalone material-removal method or as a pre-cavitation stage before chemical or plasma decapsulation.
Potential purposes
Applications for which Nisene engineering determines that laser ablation should be evaluated for controlled removal of selected package material.
Applications requiring removal of bulk encapsulant before an approved chemical, plasma or other package-opening process.
Applications requiring controlled cavity geometry while maintaining an approved remaining-material margin above sensitive internal structures.
Applications requiring evaluation of laser settings, scan strategy, cavity geometry and follow-on processing for a particular package.
Core capabilities of the supplied LE-1064 configuration.
Air-cooled 1064-nm fibre laser with 30-W average output power.
XY scanning-mirror galvanometer with a 110 × 110 mm decapsulation range.
Real-time process observation through integrated cameras and viewing windows.
1–18× laser zoom and a laser-pointer focus aid support sample positioning.
Configured laser settings support package-specific process development.
Approved geometric patterns may be used to control the area and shape of material removal.
The system may support capture or retention of process-related images, subject to current configuration verification.
Windows-based ablation software provides process control and system operation.
Laser ablation removes selected package material through controlled application of laser energy over a defined processing area.
The applicable laser conditions depend on mold-compound composition, filler content, package geometry, exposed materials, target cavity dimensions and the required remaining-material margin.
The viewing system supports positioning of the target package area before processing.
Available magnification supports evaluation of package features and cavity location, subject to current model confirmation.
The operator may observe the processing area through the system interface, subject to the current configuration and approved safety controls.
Image-saving or documentation functions remain subject to verification against the current system software and configuration.
The laser path may be configured for an approved cavity area and shape.
Material removal must be developed with an approved remaining-material margin above sensitive internal structures.
A process may use more than one approved pass or stage, subject to package requirements and system capability.
The cavity must be developed with the intended chemical, plasma, inspection or other follow-on process in mind.
Sample positioning may be carried out using the supplied standard arrangement, subject to current configuration.
A motorized vertical-axis option may be available, subject to current product configuration and quotation.
Motorized multi-axis positioning may be available for approved applications, subject to engineering review.
Automated tray or batch-handling capability must be confirmed from the current product configuration and quotation.
The supplied extraction arrangement must be positioned and operated according to approved installation documentation.
Filter stages and filter-media requirements depend on the supplied system configuration.
Any interface or interlock between the laser system and extraction equipment is confirmed for the supplied configuration.
Filter inspection, replacement and disposal requirements must be established through the approved maintenance documentation.
Laser processing may generate fumes, particulates and decomposition products. The system must not be operated without the approved extraction and filtration configuration.
Identify package construction, dimensions, mold compound, filler content, die location, wire and metallization materials and required exposure area.
Nisene applications engineering reviews whether laser ablation or pre-cavitation should be evaluated.
Confirm the approved cavity area, geometry, remaining-material margin and intended follow-on process.
Use the approved sample arrangement, alignment method and focus procedure.
Recall or establish approved laser, scan, cavity-pattern and pass parameters.
Process the sample according to the equipment manual, approved laboratory procedures and applicable laser-safety requirements.
Review the cavity and proceed to the approved inspection, chemical, plasma or other follow-on process.
Laser package processing, extraction-system operation and sample handling must be carried out only by trained personnel in an appropriately equipped laboratory using approved enclosures, interlocks, extraction, fixtures, personal protective equipment, safety documentation and site procedures.
Published specifications are shown below.
| Specification | LaserEtch LE-1064 |
|---|---|
| Process type | Laser ablation of semiconductor package material |
| Primary application | Cavity development and pre-cavitation, subject to engineering review |
| Laser source | Air-cooled 1064-nm fibre laser |
| Average output power | 30 W |
| Pulse width | 4–200 ns, selectable |
| Pulse frequency | 1–4000 kHz |
| Decapsulation range | 110 × 110 mm |
| Beam scanning | XY scanning-mirror galvanometer |
| Optical zoom | 1–18× |
| Cooling | Air-cooled integrated controller |
| Laser safety | Class 1 enclosure with door interlocks and laser-safe viewing window |
| Extraction | Fume and dust extractor |
| Software | Windows-based ablation software |
| Process viewing | Real-time observation through cameras and viewing windows |
| System dimensions | 1040 × 700 × 600 mm |
JetEtch configurations use controlled chemical processing for defined-area package decapsulation.
Explore chemical decapsulationPlasmaEtch PE-1000 uses microwave-induced plasma under vacuum for dry package decapsulation.
Explore PlasmaEtch PE-1000LaserEtch LE-1064 uses controlled laser ablation for cavity development, bulk material removal and approved pre-cavitation workflows.
You are viewing LaserEtch LE-1064Mechanical tools remove selected lids or caps from compatible hermetic packages.
Explore mechanical openingSelected applications may be evaluated using laser processing alone, subject to engineering confirmation.
Laser pre-cavitation may reduce bulk encapsulant before an approved chemical-decapsulation stage.
Laser pre-cavitation may be evaluated before an approved plasma-decapsulation stage.
Nisene applications engineering can review the package and recommend an evaluation route.
Compatibility depends on package construction, mold-compound chemistry, filler content, dimensions, die location, wire and metallization materials, target cavity geometry, remaining-material margin and intended follow-on process.
Representative results. Contact Nisene for application examples relevant to your packages.
Published specifications are shown below.
Supply requirements depend on the supplied configuration and destination territory.
The supplied enclosure, door interlocks, emergency controls and access restrictions must be confirmed for the current system configuration.
Extraction capacity, filter stages, exhaust routing and filter-management requirements must be confirmed before installation.
Clearance, supporting surface and service-access requirements
Computer, operating-system, network and data-management requirements depend on the current supplied configuration.
Monitoring, interlock and site-integration requirements
LaserEtch LE-1064 must be installed and operated only in an appropriately equipped laboratory by trained personnel. Customers are responsible for site-specific risk assessment, laser safety, enclosure and interlock integrity, electrical safety, extraction, filtration, process emissions, sample handling, personal protective equipment and compliance with applicable regulations.
Applicable compliance, declaration, laser-safety, extraction and installation documentation will be identified for the quoted system and destination and supplied where applicable.
Package review, cavity-definition review, follow-on process planning and laser-process development support for unfamiliar or challenging applications.
Available in accordance with the quotation, system configuration and applicable territory.
Technical diagnosis, repair and maintenance for supported laser, motion, camera, software and extraction components.
Replacement components, sample fixtures, extraction filters, motion components and consumables subject to current availability.
Download the available approved documents directly.
Tell us about the package, mold compound, wire and metallization materials, target cavity and intended follow-on process. Nisene will review whether LaserEtch LE-1064 is appropriate and advise on system configuration, process development and the evaluation route.
Tell us the system, the package type and what you need to achieve, and our applications team will respond.
Email sales@nisene.com Service and RMANisene Technology Group, 417A Salinas Road, Watsonville, CA 95076, USA