Nisene supplies semiconductor package-opening and failure-analysis equipment, chip-on-board LEDs and near-infrared vein-visualization systems. Contact Nisene for detailed product and application information.
Chemical, plasma, laser and mechanical package-opening systems.
JetEtch configurations use controlled chemical processing for defined-area package decapsulation.
Automated acid-decapsulation platform for repeatable laboratory processing of semiconductor packages.
Adds adjustable electrical bias intended to support copper-wire package process development.
Combines adjustable electrical bias with controlled sub-ambient etchant cooling.
Controlled laser ablation for bulk removal, cavity development and approved pre-cavitation.
Tools for selected metal can-style devices and hermetically sealed ceramic dual-inline packages.
Package type alone does not determine the appropriate route. Nisene applications engineering can review the package construction, materials and examination objective and advise on the method, configuration and evaluation route.