Nisene provides chemical, plasma, laser and mechanical package-opening systems for semiconductor failure analysis and related laboratory investigation. Method selection depends on package construction, materials and the examination objective.
Acid decapsulation of the encapsulant to expose the die and internal structures, with configurations addressing wire-bond preservation and etchant temperature.
Explore chemical decapsulationMicrowave-induced plasma processing for dry decapsulation under vacuum, for devices and encapsulants where a wet chemical method is not suitable.
Explore PlasmaEtch PE-1000Controlled laser ablation for bulk encapsulant removal, cavity development and approved pre-cavitation before a further process.
Explore LaserEtch LE-1064Tools intended for selected metal can-style devices and hermetically sealed ceramic dual-inline packages.
Explore mechanical openingJetEtch Pro is the base platform. CuProtect and TotalProtect add wire-bond protection and etchant temperature control for devices requiring them.
Automated acid-decapsulation platform for repeatable laboratory processing of semiconductor packages.
Explore JetEtch ProAdds adjustable electrical bias intended to support copper-wire package process development.
Explore CuProtectCombines adjustable electrical bias with controlled sub-ambient etchant cooling.
Explore TotalProtect| Capability | JetEtch Pro | CuProtect | TotalProtect |
|---|---|---|---|
| Chemical decapsulation | Included | Included | Included |
| Application tooling | Subject to configuration | Subject to configuration | Subject to configuration |
Every application listed below remains subject to review by Nisene applications engineering before a package is represented as supported.
Expose the die and internal structures of a failed device for examination.
Document package internals, wire-bond metallurgy and die layout.
Open suspect parts to compare die markings, construction and bond configuration.
Sample-verify supplied devices against specification.
Examine devices after stress, burn-in or field return.
Develop approved processes for new package types, encapsulants or exposure geometries.
Two devices in the same package outline may require different opening routes. Mold-compound chemistry, filler content, wire and metallization materials, die location, required exposure area and the intended examination all affect the appropriate method. A combined route — for example laser pre-cavitation followed by chemical or plasma processing — may be evaluated where engineering confirms it is appropriate.
Package review, method selection, fixture selection and process development.
Available in accordance with the quotation, system configuration and applicable territory.
Technical diagnosis, repair and maintenance for supported systems.
Replacement components, application tooling and consumables subject to current availability.
Download the available approved documents directly.
PDF document.
Download PDFPDF document.
Download PDFPDF document.
Download PDFPDF document.
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Download PDFTell us about the package, materials, required exposure area and analysis objective. Nisene will advise which method and system suit the work.
Tell us the system, the package type and what you need to achieve, and our applications team will respond.
Email sales@nisene.com Service and RMANisene Technology Group, 417A Salinas Road, Watsonville, CA 95076, USA