JETETCH PRO
JetEtch Pro is the core chemical-decapsulation platform in the Nisene JetEtch family. It is designed to remove selected semiconductor package encapsulant and expose the die and internal package structures for examination.
JetEtch Pro provides a controlled platform for chemical removal of semiconductor mold compound over a defined package area. The system supports development and recall of package-specific laboratory processes using controlled etchant delivery, temperature, timing and post-process rinse settings.
Potential purposes
Applications for which Nisene engineering determines that bias-assisted copper-wire protection is not required.
Applications requiring controlled process settings and recall of approved package-specific recipes.
Applications using suitable fixtures and gaskets to control the package area exposed to the etchant.
Laboratories developing processes for new package types, encapsulants or exposure geometries.
Capability descriptions only. No operating values are published in this section.
Configurable delivery settings support package-specific chemical-decapsulation process development.
Controlled process temperature supports repeatable application of approved recipes.
User-defined etch timing supports process adjustment for different package and exposure requirements.
Stored recipes support recall of approved laboratory process parameters.
Configurable rinse settings support the post-etch process sequence.
A dedicated system interface provides access to operating parameters, recipe selection and system status.
A controlled intermittent etchant-delivery mode intended to support package-specific process development.
A controlled etchant-flow mode intended to support defined-area package processing.
Identify package construction, dimensions, die location, wire-bond material and required exposure area.
Select the appropriate gasket, fixture, alignment component, backing element and etch-head arrangement.
Recall or establish approved parameters for etchant delivery, temperature, timing and rinse.
Process the sample in accordance with the equipment manual, approved laboratory procedures and applicable safety requirements.
Complete the approved post-process procedure before optical, electrical or other failure-analysis examination.
Chemical decapsulation must be carried out by trained personnel in an appropriately equipped laboratory, using approved chemicals, personal protective equipment, safety data sheets and site procedures.
Published specifications are shown below.
| Specification | JetEtch Pro |
|---|---|
| Process type | Chemical decapsulation of semiconductor packages |
| Etchant-delivery modes | Pulse Etch mode and Vortex Etch mode (user selectable) |
| User-selectable etch time | 1 – 1,800 seconds, in 1.0-second increments |
| Recipe capacity | 100 user-defined programs, held in non-volatile memory |
| Mixed-acid capability | Nitric : sulfuric and sulfuric : nitric, at 6:1, 5:1, 4:1 and 3:1. Etchant volume 1.0 – 10.0 mL/min (software selectable) |
| Post-etch rinse control | Nitric acid, sulfuric acid, or no rinse |
| Temperature range — nitric acid | 20 – 90 °C |
| Temperature range — sulfuric acid | 20 – 250 °C |
| Temperature range — mixed acids | 20 – 100 °C (range automatically calibrated to the selected ratio) |
| Daisy-chained recipes | No |
| System dimensions | Etcher unit 290 h × 290 w × 419 d mm (11.5 × 11.5 × 16.5 in). Bottle container 230 h × 110 w × 110 d mm (9 × 4.25 × 4.25 in) |
| System weight | 17 kg (38 lb), excluding bottle container and accessories |
| Electrical supply | 350 W at 95 – 130 VAC, or 350 W at 210 – 250 VAC |
| Pneumatic supply | Clean dry air at 4.2 kg/cm² (60 – 100 psi). Nitrogen supply 2.8 lpm (0.1 cfm) |
| Exhaust requirements | Installation in a chemical fume hood is required, with a minimum flow rate of 0.5 m/s (100 surface ft/min) |
| Standard accessory kit | A standard basic Accessory Kit is supplied with every JetEtch Pro system |
| Optional accessory kits | DIP/SIP 0300601 · PLCC 0300602 · SOIC 0300603 · QFP 0300604 · PBGA 0300605 · Die-down BGA 0300606 · QFN/MLP 0300609 · Universal Accessory Kit 0300612. Custom-designed Monolithic Gaskets are also available |
| Certifications and standards | CE certification, SEMI S-2-93, SEMI S-2-2000, as printed in the brochure. |
| Warranty | 12-month warranty covering all parts and labour, excluding consumable items. 5-year warranty on the micrometering pump assembly |
Base JetEtch platform for chemical-decapsulation applications that do not require the added copper-wire bias capability or sub-ambient etchant cooling.
You are viewing JetEtch ProAdds adjustable electrical bias intended to support preservation of copper-wire structures during chemical decapsulation.
Explore CuProtectCombines bias-assisted copper-wire protection with controlled sub-ambient etchant cooling.
Explore TotalProtectJetEtch Pro uses package-specific fixtures and gaskets to locate the sample, define the etch area and support controlled processing.
Contact Nisene for compatibility, kit contents and availability.
Contact Nisene for compatibility, kit contents and availability.
Contact Nisene for compatibility, kit contents and availability.
Contact Nisene for compatibility, kit contents and availability.
Contact Nisene for compatibility, kit contents and availability.
Contact Nisene for compatibility, kit contents and availability.
Contact Nisene for compatibility, kit contents and availability.
Contact Nisene for compatibility, kit contents and availability.
Position the package relative to the defined etch opening.
Define the area of encapsulant exposed to the etchant.
Combine sample location and cavity definition in a custom single-piece fixture.
Support selected die-down BGA and other package configurations requiring raised geometry.
Support larger packages or packages requiring dedicated alignment and backing arrangements.
Complete the sample stack-up and support controlled pressure, alignment and, where applicable, electrical bias.
Package compatibility depends on construction, dimensions, die location, mold compound, wire-bond material, fixture availability and required exposure area.
Representative results. Contact Nisene for application examples relevant to your packages.
Published specifications are shown below.
Installation requirements must be confirmed from the current facility-requirements document.
Required supplies depend on the current JetEtch Pro configuration and destination territory.
The customer facility must meet applicable chemical-storage, handling and waste-management requirements.
Clearance, supporting surface and service-access requirements must be confirmed before installation.
JetEtch Pro must be installed and operated only in an appropriately equipped laboratory by trained personnel. Customers are responsible for site-specific risk assessment, approved chemicals, ventilation, waste handling, personal protective equipment and compliance with applicable regulations.
Applicable compliance, declaration and installation documentation will be identified for the quoted system and destination and supplied where applicable.
Fixture selection, sample review and process-development support for unfamiliar or challenging packages.
Available in accordance with the quotation, system configuration and applicable territory.
Technical diagnosis, repair and maintenance for supported systems.
Replacement components, application tooling and consumables subject to current availability.
Download the available approved documents directly.
Tell us about the package, wire-bond material, required exposure area and analysis objective. Nisene will review the application and advise on system configuration, fixture selection and the appropriate evaluation route.
Tell us the system, the package type and what you need to achieve, and our applications team will respond.
Email sales@nisene.com Service and RMANisene Technology Group, 417A Salinas Road, Watsonville, CA 95076, USA