Three chemical decapsulation configurations built on a common JetEtch Pro platform. This page compares the configurations so an appropriate one can be identified for a given application. Process principles, package handling and fixture selection are covered separately on the chemical decapsulation page.
All three configurations share the same etcher unit, reservoir arrangement, etchant chemistry, etch timing, recipe storage and rinse control, as published in their respective brochure specification pages. They differ in the process controls layered on top of that platform.
290 h × 290 w × 419 d mm, 17 kg excluding bottle container and accessories.
Fuming nitric, fuming sulfuric and concentrated sulfuric, plus mixed-acid ratios at 6:1, 5:1, 4:1 and 3:1 in both directions.
1 – 1,800 second etch time in 1.0-second increments, Pulse and Vortex etch modes, 100 stored user-defined programs.
Bias selection and the stated minimum etchant temperature. Those differences are set out in the comparison below.
Each configuration has its own page carrying the full specification transcribed from its brochure.
The core platform configuration. Programmable chemical decapsulation using nitric, sulfuric and mixed acids, with user-defined etch time, temperature, rinse and recipe storage.
Adds user-selectable electrical bias to the JetEtch Pro platform, supporting process development for integrated circuits with copper bond wires.
Combines bias selection with a cooling feature that allows sub-ambient cooling of the etching acid, lowering the stated minimum etchant temperature.
Configuration selection depends on the device under examination and the structures that must survive the process. Nisene reviews the application before a configuration is recommended.
Where no electrical bias is required during the etch, the core JetEtch Pro configuration covers the published chemistry, timing and temperature range.
Where an applied electrical bias forms part of the process, CuPROTECT adds user-selectable bias between 0.0 and 20 V.
Where process development below 20 °C is required, TotalPROTECT states a 10 °C lower limit across nitric, sulfuric and mixed acids.
Package construction, materials and the examination objective determine the recipe and fixturing.
Values transcribed from the specification pages of the three approved brochures and the published Nisene comparison table. “Same” means the value published for that configuration matches the JetEtch Pro column.
| Specification | JetEtch Pro | CuPROTECT | TotalPROTECT |
|---|---|---|---|
| Etcher unit dimensions | 290 h × 290 w × 419 d mm | Same | Same |
| Weight | 17 kg (38 lb) | Same | Same |
| Power | 350 W at 95–130 VAC or 210–250 VAC | Same | Same |
| Etchant volume | 1.0 – 10.0 mL/min | Same | Same |
| Mixed-acid ratios | 6:1, 5:1, 4:1, 3:1 (both directions) | Same | Same |
| Etch time | 1 – 1,800 s, 1.0-s increments | Same | Same |
| Etch modes | Pulse Etch, Vortex Etch | Same | Same |
| Heat-up time | 0 – 120 s, 1.0-s increments | Same | Same |
| Recipe capacity | 100 user-defined programs | Same | Same |
| Temperature — nitric acid | 20 – 90 °C | 20 – 90 °C | 10 – 90 °C |
| Temperature — mixed acids | 20 – 100 °C | 20 – 100 °C | 10 – 100 °C |
| Bias selection | No | 0.0 – 20 V, 0.1-V increments | 0.0 – 20 V, 0.1-V increments |
| Sub-ambient etchant cooling | No | No | Described in the insert as a cooling feature allowing sub-ambient cooling of the etching acid |
| Rinse options | Nitric acid, sulfuric acid, or no rinse | Same | Same |
| Reservoirs | 4 bottles standard: 2 acid, 2 waste | Same | Same |
| Certifications as printed | CE, SEMI S-2-93, SEMI S-2-2000 | Same | Same |
| Warranty | 12-month parts and labour; 5-year pump assembly | Same | Same |
This page compares configurations. The underlying process — how chemical decapsulation works, package handling, defined-area processing, fixture and gasket selection, and process considerations — is covered on the chemical decapsulation page.
Download the available approved documents directly.
Tell us about the package, wire-bond material, required exposure area and analysis objective. Nisene will review the application and advise on system configuration, fixture selection and the appropriate evaluation route.
Tell us the system, the package type and what you need to achieve, and our applications team will respond.
Email sales@nisene.com Service and RMANisene Technology Group, 417A Salinas Road, Watsonville, CA 95076, USA