Nisene Technology Group

Precision equipment and advanced electronics for demanding applications.

Nisene Technology Group provides semiconductor package-opening and failure-analysis equipment, chip-on-board LEDs and near-infrared vein-visualization systems. Nisene is based in Watsonville, California, USA.

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Conceptual visual connecting semiconductor analysis, advanced light technologies and medical imaging.

Three product lines

JetEtch Pro automated acid decapsulation system, showing the touchscreen control panel, sealed process chamber and four-bottle reservoir module.

Failure Analysis Tools

Chemical, plasma, laser and mechanical package-opening systems for semiconductor failure analysis, construction analysis and component investigation.

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Polymatech chip-on-board LED emitter with a white-light emitting surface on a square substrate, showing polarity-marked solder pads and two diagonal mounting holes.

Chip-on-Board LEDs

Chip-on-board LED products for selected medical, horticulture, ultraviolet, infrared and specialty-lighting applications.

Eleven products across 30 mm platforms, with direct downloads for published technical documents.

Chip-on-Board LEDs

Ravaye E2 Vein Finder handheld unit, model PM-VF-100, showing the display and directional control pad.

Medical Instruments

Near-infrared vein-visualization systems intended to support visualization of superficial vein patterns.

Stocked and serviced in the United States by Nisene, U.S. FDA Agent for the manufacturer.

Medical Instruments

Package-opening technologies

Method selection depends on package construction, materials and the examination objective. No numeric specifications are published on this page.

Chemical

Chemical decapsulation

JetEtch configurations use controlled chemical processing for defined-area package decapsulation.

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Plasma

Plasma decapsulation

PlasmaEtch PE-1000 uses microwave-induced plasma under vacuum for dry package decapsulation.

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Laser

Laser decapsulation

LaserEtch LE-1064 uses controlled laser ablation for cavity development and approved pre-cavitation workflows.

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Mechanical

Mechanical package opening

Nisene mechanical tools are intended for selected metal can and ceramic hermetic package constructions.

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Support across the equipment lifecycle

Applications engineering

Package review, method selection, tooling and process-development support.

Service and repair

Technical diagnosis, repair and maintenance for supported systems.

Training

Equipment, applications and safety orientation aligned to the supplied system.

Spare parts and fixtures

Replacement components, application tooling and consumables subject to availability.

Engineering and support from Watsonville, California

Nisene Technology Group is based in Watsonville, California, USA, and supports laboratories and customers through equipment supply, applications engineering, service, training and replacement tooling.