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HCP Technologies appointed authorised sales and service partner for India; first order already secured
Announced at SEMICON India 2026 · 17 September 2026
WATSONVILLE, CALIFORNIA – 17 September 2026 – Nisene Technology Group, Inc. (www.nisene.com) today announced the appointment of HCP Technologies Private Limited as its authorised sales and service partner for India, expanding local access to Nisene’s semiconductor decapsulation (package-opening) and failure-analysis systems. The announcement coincides with SEMICON India 2026 at Yashobhoomi, New Delhi. The partner agreement has been executed, and HCP Technologies has already secured its first order for a Nisene system in India.
Nisene’s portfolio, led by the JetEtch Pro acid-decapsulation platform, covers chemical, plasma, laser and mechanical package-opening solutions for semiconductor device analysis, reliability investigation and root-cause examination. HCP Technologies will lead customer engagement, demonstrations, application coordination, sales and first-line service in India, working directly with Nisene’s application engineers in the United States. Nisene retains responsibility for product configuration, technical approvals, warranties and advanced service support, so that customers in India receive the same standards as Nisene customers worldwide.
HCP Technologies is headquartered in Bengaluru, with service coverage in New Delhi, placing authorised support within reach of India’s principal semiconductor, packaging and research clusters. Semiconductor manufacturers, OSATs (outsourced semiconductor assembly and test) and test houses, laboratories, research institutions and electronics companies in India now have a local, authorised point of contact for evaluation, applications support, installation and service of Nisene systems.
“India is building semiconductor capability across design, manufacturing, packaging, testing and research. As this ecosystem grows, precision package opening and failure analysis become increasingly important for reliability, process learning and root-cause investigation. HCP’s local presence brings Nisene closer to Indian customers, with the same application review, product configuration and support standards that Nisene applies worldwide. That the partnership has produced its first order even before this announcement speaks to the demand,”
said Eswara Rao Nandam, President and CEO, Nisene Technology Group, Inc.
“India’s semiconductor sector needs responsive local access to specialised failure-analysis equipment and service coordination. We are pleased to represent Nisene in India and to work closely with its technical teams in supporting customers,”
said Purushothaman Arumugam, Founder and Managing Director, HCP Technologies Private Limited.
Nisene Technology Group, Inc. (www.nisene.com) — a five-decade company in semiconductor failure-analysis equipment manufacturing — is based in Watsonville, California, USA, and is a wholly owned U.S. subsidiary of Polymatech Electronics Limited, India. Nisene provides semiconductor decapsulation and failure-analysis equipment, including chemical (JetEtch Pro), plasma, laser and mechanical package-opening solutions, to semiconductor laboratories, manufacturers and research organisations worldwide. For more information, visit www.nisene.com.
HCP Technologies Private Limited is an Indian capital-equipment company headquartered in Bengaluru, Karnataka, with service coverage in New Delhi. It is Nisene’s authorised sales and service partner for India. For more information, visit www.hcptech.in.
HCP Technologies Private Limited · Purushothaman Arumugam · +91 99022 14257 · purusho@hcptech.in · www.hcptech.in
Nisene Technology Group, Inc.
417A Salinas Road, Watsonville, California 95076, USA
Email: nandamrao@nisene.com ·
Website: www.nisene.com
Nisene appoints regional partners on a non-exclusive basis. Product availability, configuration, service scope and commercial terms are confirmed by Nisene in writing.