PLASMAETCH PE-1000
PlasmaEtch PE-1000 is designed for dry removal of semiconductor package encapsulant using microwave-induced plasma under vacuum. The system provides an alternative process route for packages and internal structures for which wet chemical decapsulation may not be appropriate.
PlasmaEtch PE-1000 uses microwave-induced plasma processing under vacuum to remove selected package encapsulant and expose semiconductor dies and internal structures for examination.
The dry process provides an alternative to wet chemical decapsulation and may be evaluated for packages, wire materials or analysis objectives where chemical exposure is undesirable or unsuitable.
Potential purposes
Applications for which Nisene engineering determines that a plasma-based dry process should be evaluated instead of wet chemical decapsulation.
Applications involving wire bonds, metallization or other internal structures requiring controlled material-compatibility review.
Applications where the laboratory seeks to evaluate a dry process and its post-process cleaning requirements.
Applications requiring controlled development of plasma conditions for a particular mold compound, package construction and exposure objective.
Capability descriptions only. No operating values are published in this section.
The system uses microwave energy to generate plasma for controlled package-encapsulant removal.
Processing takes place within a controlled vacuum chamber configuration.
Configured gas-delivery controls support development of approved package-specific plasma processes.
Vacuum and process-pressure settings form part of the approved plasma recipe.
User-defined processing stages support adjustment for package and exposure requirements.
Stored recipes support recall of approved laboratory process parameters.
The process platform supports sample positioning according to the approved fixture and application arrangement.
A dedicated interface provides access to process settings, recipe selection, vacuum status and system operating information.
Microwave-induced plasma provides energy for controlled removal of selected organic package material within a vacuum process environment.
The applicable plasma conditions depend on mold-compound composition, filler content, exposed metals, wire materials, package geometry and the required end point.
The process-gas architecture supplied with the system depends on the current PE-1000 configuration and destination requirements.
Approved process-gas parameters may form part of a package-specific laboratory recipe.
Gas selection and process conditions depend on mold compound, filler composition, exposed materials and analysis objectives.
Gas supply, exhaust, storage, monitoring and regulatory requirements must be confirmed for the supplied configuration and installation site.
Samples may be positioned individually according to the approved application arrangement.
The platform may support more than one sample, subject to chamber configuration, sample dimensions and engineering review.
Sample position and spacing must be established for uniform and controlled processing.
Approved holders or positioning components support repeatable sample placement.
Identify package construction, dimensions, mold compound, filler content, die location, wire and metallization materials and required exposure area.
Nisene applications engineering reviews whether microwave-induced plasma decapsulation should be evaluated.
Select the approved holder, platform position, sample spacing and chamber arrangement.
Confirm the supplied process-gas, vacuum, exhaust, electrical and site-safety requirements.
Recall or establish approved plasma, pressure, gas-delivery, timing and endpoint parameters.
Process the sample according to the equipment manual, approved laboratory procedures and applicable safety requirements.
Complete the approved post-process and inspection procedure before optical, electrical or other failure-analysis examination.
Microwave-induced plasma decapsulation, vacuum operation and process-gas handling must be carried out only by trained personnel in an appropriately equipped laboratory using approved gas systems, exhaust arrangements, fixtures, personal protective equipment, safety documentation and site procedures.
Published values from the current PE-1000 product literature.
| Specification | PlasmaEtch PE-1000 |
|---|---|
| Process type | Microwave-induced plasma decapsulation under vacuum |
| Plasma-generation method | Microwave-induced plasma |
| Process environment | Vacuum plasma |
| Microwave frequency | 2.4 GHz |
| Microwave power | Up to 1000 W |
| Reaction gases | O2 and H2 |
| Gas supply | Integrated gas generator; no gas tank required |
| Stage size | 70 mm diameter |
| Sample processing | Multiple samples may be processed in one cycle |
| Electrical supply | 220 V, 2500 W, single phase |
| System dimensions | 128 × 84 × 170 cm |
JetEtch configurations use controlled chemical processing for defined-area package decapsulation.
Explore chemical decapsulationPlasmaEtch PE-1000 uses microwave-induced plasma under vacuum for dry package decapsulation.
You are viewing PlasmaEtch PE-1000LaserEtch LE-1064 removes selected bulk encapsulant by laser ablation and may be evaluated for pre-cavitation before another decapsulation method, subject to Nisene engineering review.
Explore LaserEtch LE-1064Mechanical tools remove selected lids or caps from compatible hermetic packages.
Explore mechanical openingCompatibility depends on package construction, mold-compound chemistry, filler content, dimensions, die location, wire and metallization materials, sample arrangement and required exposure area.
Plan the installation around the published PE-1000 configuration and applicable local safety requirements.
220 V, 2500 W, single phase.
Allow for the published 128 × 84 × 170 cm system dimensions, operating clearance and service access.
The published configuration uses O2 and H2 with an integrated gas generator, avoiding stored process-gas tanks.
The 70 mm-diameter stage supports processing of multiple samples in one cycle.
Provide suitable placement and service access for the vacuum-plasma system.
Installation remains subject to applicable electrical, ventilation, laboratory and workplace-safety requirements.
PlasmaEtch PE-1000 must be installed and operated only in an appropriately equipped laboratory by trained personnel. Customers are responsible for site-specific risk assessment, electrical safety, microwave-system safety, vacuum-system safety, approved process gases, gas monitoring, exhaust, ventilation, personal protective equipment and compliance with applicable regulations.
Applicable compliance, declaration, gas-safety and installation documentation will be identified for the quoted system and destination and supplied where applicable.
Package review, material review, sample-arrangement selection and plasma-process development support for unfamiliar or challenging applications.
Available in accordance with the quotation, system configuration and applicable territory.
Technical diagnosis, repair and maintenance for supported plasma, vacuum and gas-control components.
Replacement components, sample holders, vacuum components, gas-control components and consumables subject to current availability.
Current document revisions are available on request.
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Request this documentTell us about the package, mold compound, wire and metallization materials, required exposure area and analysis objective. Nisene will review whether PlasmaEtch PE-1000 is appropriate and advise on system configuration, sample arrangement and the evaluation route.
Tell us the system, the package type and what you need to achieve, and our applications team will respond.
Email sales@nisene.com Service and RMANisene Technology Group, 417A Salinas Road, Watsonville, CA 95076, USA