The Nisene Family of Products

Check Out Our Current Product Line!

A complete list of our current products can be seen below, along with a few of our older products that you might still find out in the field. 


PlasmaEtch (2014-present)PlasmaEtch


The PlasmaEtch is a groundbreaking technological marvel used for the etching of encapsulated integrated circuits by a proprietary combination of reactive ion etching, microwave radiation, and vacuum.

Click to read more about the PlasmaEtch.


JetEtch Pro (2011-present)JetEtch Pro

Status: supported.

Automated decapsulation system for the etching of integrated circuits. The baseline decap model for the line of Nisene Technology Group's decappers. 

Click to read more about the JetEtch Pro.


JetEtch Pro CuProtect (2011-present)JetEtch Pro CuProtect

Status: supported.

The enhanced model to the JetEtch Pro (above), engineered for the preservation of copper wires and other internal structures. Doubles as standard JetEtch Pro when CuProtect mode is deactivated.

Click to read more about the JetEtch Pro CuProtect.


JetEtch Pro TotalProtect (2013-present)JetEtch Pro TotalProtect

Status: supported.

The top of the line decapsulation system, featuring everything from the CuProtect model (above), JetEtch Pro baseline model (top), and with an added cooling module that offers the end user with the maximum etching flexibility. Yet another illustration of Nisene's advanced technology.

Click to read more about the JetEtch Pro Total Protect.


JetEtch II (2008-2011)JetEtch II

Status: Supported.

The predecessor to the JetEtch Pro, the JetEtch II was the Nisene flagship model circa 2008-2011. This model was replaced by the JetEtch Pro, but is still supported fully. 

Click for questions, service, applications, or other support for the JetEtch II.


JetEtch (2004-2008)JetEtch

Status: Near Obsolescence / Limited Support. *

Prior to the JetEtch II, Nisene offered overhauled the famous d2-i decapsulation system and as a tribute to the original decapsulation system started the "JetEtch" nomenclature again. This system was sold between the years of 2004-2008 before being replaced in the lineup with the JetEtch II.

Click for questions, service, applications, or other support for the JetEtch.




The Nisene Technology Group CERDIP Opener is the solution to opening ceramic dual inline packages, or CERDIPs. To view our CERDIP Opener page, please click here.


Can OpenerCan Opener


Our Can Opener allows for the mechanical decapsulation of "can"-type packages, used often in military applications. View our Can Opener page by clicking here.



STATUS: Discontinued / Supported *

The GelEtch delayering system was an enhanced and overhauled version of its predecessor, the OmniEtch. The GelEtch was released in 2009 and was manufactured through 2015. In its heyday, the GelEtch was the only chemical die delayering system on the market. Click here to read more about the GelEtch.


The Nisene Family of Products — Legacy

Below you will find many legacy products from Nisene Technology Group, Inc. 


350 d2-i (2000-2004)350 d2-i

Status: Obsolete / Not Supported *

Having sold thousands of d2-i systems, Nisene still regularly receives requests for support by customers who purchased their d2-i systems over 10 years ago! A great system, and an absolute workhorse, the d2-i was the culmination of all of the great attributes of the 350 series, and the last to bear the "350" prefix. Succeeded by the JetEtch family in 2004.

Click for questions about the d2-i.


350Image Coming Soon

Status: Obsolete.

The 350 series was arguably the most important and is possibly still the most widely known family of decapsulation systems on the market. The 350 series introduced true dual-acid etching where both nitric and sulfuric acids could be installed in the same system at the same time. Not only that but it had real-time automated mixing of etchant acids. It was at this time that we also developed the concept of the waste diverter and dual bottle box setup. It was this generation of automated decapsulation system that first incorporated the familiar look of our current models — the "shoebox" design.



STATUS: Obsolete.

The OmniEtch delayering system was the world's first automated, chemical-based die delayering system. Introduced in 2005, the OmniEtch was groundbreaking and revolutionary, as no other method before it — neither mechanical polishing nor RIE — offered the same level of planarity of etched die layers. The OmniEtch was replaced by the in GelEtch 2009.


Check Out Our Vintage Models and More!


If you'd like to have a look at the history of products offered by Nisene during our storied history as the world leader in automated decapsulation, please click here (coming soon). We have put together a nice animated timeline that illustrates where it all began in the 1970s to where we are now — almost 40 years later! 

Note that these products are no longer technically supported by Nisene, so if you have one of these and are trying to find service for it we may not be able to help; however, give us a call and we'll do our best to help you out anyway! 


* = Limited support may be available. Not eligible for extended warranties.