Welcome to Nisene Technology Group, Inc.

World Leaders in Automated IC Decapsulation Solutions

For over six decades, Nisene Technology Group has set the standard for precision, innovation and reliability in the semiconductor failure analysis and counterfeit detection industry. Our advanced decapsulation tools, including chemical based JetEtch system, laser based pre-cavitation LE1064 and Microwave Induced PlasmaEtch IC decap solutions, empower engineers and researchers to perform critical IC (Integrated Circuit) analysis efficiently, cleanly, and safely.

Our Product Line

Chemical Decapsulation

Next-Generation Dry Decapsulation

Precision Laser Decapsulation

LaserEtch Product Shot

JetEtch CuProtect

JetEtch Pro CuProtect Product Shot

JetEtch Total Protect

JetEtch Pro TotalProtect Product Shot

Why Choose Nisene?

Decades of Experience

Pioneering IC decapsulation since the inception of the semiconductor industry.

Unmatched Precision

From microscopic components to thick packages, our tools guarantee superior results.

Eco-Conscious Innovation

Chemical and dry-decapsulation options to suit your environmental and operational needs.

Global Support

Trusted worldwide by semiconductor labs, manufacturers, and academic institutions.

Patented Pump

Robust Heat Exchanger

Advanced Software

Next-generation Technology

Ease-of-Use

JetEtch Pro

Safety Features

Affordable

Industry-leading Warranty

Click here for full specs

Product Brochure

Testimonials

Industries We Serve

Our products power critical failure analysis, reliability testing, and counterfeit detection across industries:

Discover the Future of Decapsulation

At Nisene, we’re committed to advancing semiconductor technology through cutting-edge decapsulation solutions that enable failure analysis and innovation.

Nisene Technology Group, Inc. – Precision. Innovation. Excellence.

Comparison Table for JetEtch Products 2025

JetEtch ProJetEtch CuProtectJetEtch TotalProtect
JetEtch Pro CuProtect Product ShotJetEtch Pro TotalProtect Product Shot
Sub-Ambient Etch Capability--
Cu Wire Bias Protection-
Temperature Range up to 250C TotalProtect 5C to 150C*-
Types of Wire (Au, Cu, CuP, Al)**

*Acid Consumption goes up with lower temperature etching
**JetEtch Pro capable of etching parts with listed bonding wires but not as clean an etch as that provided by the CuProtect and TotalProtect

Our Customers Worldwide