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ISO Cu Wire Preservation

Nisene first saw copper bond wires almost 10 years ago. They were like a unicorn…a mythical creature created from the hysteria surrounding rapidly rising costs for gold. While the cost of gold has historically increased and decreased, the switch to copper metal bonding actually created a technological advantage, so much so that it solidified copper’s […]
Copper Wire Decap for SOT-223 Device!

Today we etched a SOT-223 device and protected the sensitive copper wires inside. Have a look! Feel free to click on the photo to view the full-size version: Wow! Even though we are using nitric and sulfuric acids, the JetEtch Pro CuProtect is quite capable of preserving the wires. Using nothing more than a very […]
BGA Decapsulation with Monolithic Gasket and Custom Backer

Today we decapsulated a BGA that was very stubborn to etch. After a few iterations of nitric-only and mixed-acid etches with nitric and sulfuric that didn\’t seem to penetrate the encapsulant, we decided to give it a shot with a higher temperature sulfuric acid etch. The JetEtch Pro rose to the occasion with an absolutely […]
Multiple Sample Etching in PlasmaEtch

Did you know that multiple samples can be processed at the same time in the Nisene PlasmaEtch? Because we have a 20x20mm effective decap zone, if multiple samples can fit in the 20x20mm one, they can all be decapped at the same time. Take for example the sample in Figure 1. This EXAR sample is […]
Effects of Excessive Ultrasonic Processing

It has long been an industry practice of post-decap cleaning an integrated circuit via ultrasonic. This process is done for multiple reasons. Decapsulation done through wet-chemical processing, like the JetEtch, can result in residue on the surface of the die and bond wires. While this residue doesn’t necessarily need to be removed, it can inhibit visual inspection. It is […]
Accelerated Plasma Decap with CF4

The Nisene PlasmaEtch was specifically designed to include the use of CF4 gas for many reasons. One of those reasons is CF4’s ability to break-up silica in mold compound. By allowing a plasma process to incorporate CF4, an end user has more flexibility to adjust their recipe when a mold compound has a higher silica count […]
Online Shop
Get your Nisene decap spares on our online shop, shop.nisene.com. With our \”members only\” setup, customers of our automated chemical decapsulation systems will be able to buy spare parts for a wide variety of etchers. From the newer JetEtch Pro to older 350 DCap or d2-i models, we have a large inventory of spares and […]
We’ve Moved!
Nisene Technology Group, Inc. has moved into a new facility down the road. We are now in a business park, just a few short miles away from our previous facility. Our new address is: 165 Westridge DriveWatsonville, CA 95076 Please make a note of it. Same great engineering, service, professionalism, and customer satisfaction; new address!
New RMA Service
Are you having issues with your JetEtch decapsulation system? Not to worry! Nisene has you covered. Using our new RMA system, our customers are able to create a ticket online, directly interacting with our service professionals and having the entire message chain tracked for reference later on. If you have coworkers who want to be […]