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Semiconductor Failure Analysis: Pioneering the Future with Nisene Technology Group, Inc.
Ever wondered who’s behind the innovations that power today’s advanced technologies? Dive into the fascinating world of Nisene Technology Group, Inc., the trailblazers in semiconductor failure analysis! Decades of Dedication Nisene Technology Group, Inc. isn’t new to the scene. Since the 1970s, our footprint has been deeply etched (pun intended!) in the realm of automated […]
Detecting the Invisible: A Journey into Semiconductor Failure Analysis
Introduction: In our increasingly technology-driven world, semiconductors are the unsung heroes that power our devices and electronics. From smartphones and computers to medical equipment and automobiles, semiconductors play a crucial role in shaping our daily lives. However, like all technological marvels, they are not immune to failure. When a semiconductor device malfunctions, it can be […]
Unveiling the Secrets: The Importance of Acid Decapsulation in Semiconductor Analysis
Imagine holding a piece of technology in your hand and pondering about the miniature world inside it. Do you ever wonder what secrets lie deep within, shielded by a semiconductor’s protective casing? To explore these mysteries, we turn to a specialized process called acid decapsulation. This procedure uncovers the hidden truths embedded within semiconductors, allowing […]
ISO Cu Wire Preservation
Nisene first saw copper bond wires almost 10 years ago. They were like a unicorn…a mythical creature created from the hysteria surrounding rapidly rising costs for gold. While the cost of gold has historically increased and decreased, the switch to copper metal bonding actually created a technological advantage, so much so that it solidified copper’s […]
Copper Wire Decap for SOT-223 Device!
Today we etched a SOT-223 device and protected the sensitive copper wires inside. Have a look! Feel free to click on the photo to view the full-size version: Wow! Even though we are using nitric and sulfuric acids, the JetEtch Pro CuProtect is quite capable of preserving the wires. Using nothing more than a very […]
BGA Decapsulation with Monolithic Gasket and Custom Backer
Today we decapsulated a BGA that was very stubborn to etch. After a few iterations of nitric-only and mixed-acid etches with nitric and sulfuric that didn\’t seem to penetrate the encapsulant, we decided to give it a shot with a higher temperature sulfuric acid etch. The JetEtch Pro rose to the occasion with an absolutely […]
Multiple Sample Etching in PlasmaEtch
Did you know that multiple samples can be processed at the same time in the Nisene PlasmaEtch? Because we have a 20x20mm effective decap zone, if multiple samples can fit in the 20x20mm one, they can all be decapped at the same time. Take for example the sample in Figure 1. This EXAR sample is […]
Effects of Excessive Ultrasonic Processing
It has long been an industry practice of post-decap cleaning an integrated circuit via ultrasonic. This process is done for multiple reasons. Decapsulation done through wet-chemical processing, like the JetEtch, can result in residue on the surface of the die and bond wires. While this residue doesn’t necessarily need to be removed, it can inhibit visual inspection. It is […]
Accelerated Plasma Decap with CF4
The Nisene PlasmaEtch was specifically designed to include the use of CF4 gas for many reasons. One of those reasons is CF4’s ability to break-up silica in mold compound. By allowing a plasma process to incorporate CF4, an end user has more flexibility to adjust their recipe when a mold compound has a higher silica count […]
Online Shop
Get your Nisene decap spares on our online shop, shop.nisene.com. With our \”members only\” setup, customers of our automated chemical decapsulation systems will be able to buy spare parts for a wide variety of etchers. From the newer JetEtch Pro to older 350 DCap or d2-i models, we have a large inventory of spares and […]