Nisene, trusted worldwide for IC decapsulation. Empower your students with cutting-edge technology using Grants. |
Laser decapsulation is a highly precise and effective method of removing plastic encapsulant material from a device. By using a 20W 1064nm laser, the encapsulant material is vaporized, eliminating the risk of accidentally destroying or washing away a defect with decapsulation chemicals. This method is particularly useful for small or oddly-shaped devices that would be challenging to expose chemically. Additionally, laser decapsulation reduces the need for chemical consumables. Our advanced in-line camera with laser technology enables simultaneous viewing and etching of devices. With a large optical zoom of 18x, our camera can view devices ranging from 1mm to 100mm in size. Experience precision and efficiency with our cutting-edge technology.
A Polymatech Company
Nisene Technology Group is the world leader in automated decapsulation. We’ve been doing this since the 1970s, back in the days of the original Jet Etch decapsulation system — the very first automated IC decapsulation system. Now with advanced Microwave Induced Plasma for IC decapsulation.