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Nisene Technology Group is the world leader in automated decapsulation. We’ve been doing this since the 1970s, back in the days of the original Jet Etch decapsulation system — the very first automated IC decapsulation system. Now with advanced Microwave Induced Plasma for IC decapsulation.
Copper Wire Decap for SOT-223 Device!
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Today we etched a SOT-223 device and protected the sensitive copper wires inside. Have a look! Feel free to click on the photo to view the full-size version:
Complete die exposure of SOT-223
Wow!
Even though we are using nitric and sulfuric acids, the JetEtch Pro CuProtect is quite capable of preserving the wires. Using nothing more than a very basic Definition/Location Gasket stack-up with gaskets that can be found in our accessory kits — and of course an aluminum blank to conduct the bias — we opened this sample in a very short period of time, using very little acid.
This sample required only 360 seconds of etch time with a 3:1 mix at 38ºC, with a flow rate of 2ml/min.
Try finding results like this on competing systems!