Nisene Technology Group — formerly B&G International — has been the world leader in decapsulator technology since its introduction into the semiconductor industry over 30 years ago. We offer the failure analysis segment of the semiconductor industry the most cutting-edge technology in plastic IC decapsulation. With the complexity of integrated circuits increasing and the physical sizes decreasing, Nisene Technology Group/B&G International has constantly strived toward and successfully maintained its goal to stay on top of the decapsulation field by offering its customers the most sophisticated decapsulation technology in the world. With the JetEtch decapsulation system, this is what you get.

With the need for more involved failure analysis techniques comes the need for the equipment that can assist in this process. The delayering of integrated circuits (at the wafer/bare die and package level) is a direction in which the industry is currently headed. As such, and to keep in line with Nisene Technology Group/B&G International's history of offering the best wet chemical decapsulation on the market, we have created a new product line: the OmniEtch delayering system.

You may be asking yourself:

"What is 'decapsulation' anyway?"

Click here to read more about decapsulation.

or

"What is 'delayering?' "

Click here to read more about delayering.