OmniEtch Delayering System
As the need for more sophisticated failure analysis grows, so, too, must the instrumentation with which the industry's most complex integrated circuits are analyzed. In collaboration with Texas Instruments, NTG has developed the latest in delayering technology, the OmniEtch.
With its unique, proprietary method of wet chemical delivery to an integrated circuit (either individual die or wafer-level), the OmniEtch is capable of delayering a die — one selective level at a time! The benefit that the OmniEtch has over previous methods — such as lapping — are numerous; the primary being that the etching is layer-specific. Due to its uniquely engineered medium, the die's vias remain intact during the etch, with underlying layers remaining completely unaffected.
Click the image above or here for product specifications on the OmniEtch.
