JetEtch Acid Decapsulator
The JetEtch automated acid decapsulator has been very well received since its introduction in 1999 at SEMICON Test and Packaging Exhibition, Singapore. Some of the features and benefits incorporated into this series of decapsulators, included:
- Wide range of user selectable acid mix ratios
- Ability to perform multi-step decapsulation processes
- Vortex etching enabling rapid decapping with minimal acid consumption
- Optimization of acid carrying capacity to maximize vortex etching
- Pulse acid etching
- Lifetime etch head warranty
- Interchangable etch head inserts (optional)
- Pneumo-electric pumping with bi-directional capabilities
- Smartware waste diverter valving to eliminate potential hazardous waste problems
- Safety awareness in design, including ease of bottle exchange
- Software compiled in C
- CE certification
- SEMI S-2 compliance
Evolution
Packaging technology is constantly changing. At the time of writing we are experiencing increasing requirements for automated acid decapsulation of complex packages. These packages cover a wide range of designs, which can be summarized into the following categories:
- High-density micro BGAs
- FPBGAs
- High-density die down BGAs
- Multi-die BGAs
- Stacked Chip BGAs
- CSPs
- Multi-die CSPs
- Stacked Chip CSPs
Our vortex etching capabilities allow most plastic packages, including many of the above, to be routinely opened in a consistent and reproducible manner. In conjunction with the Nisene Technology Group’s monolithic gasket technology we are well positioned to open all of the above packages with relative ease.
To expose a die and first bond is simple, but to expose the entire surface of very large die is difficult. Similarly exposure of peripheral components of a package including regions of the second (stitch) bond is difficult.
Conventional etch head designs impose certain limitations to package decapsulation, especially in the latter category where interest is in peripheral morphology.
In a conventional etch head design the heated etchant is jetted onto the sample surface through a central port. The acid after digestion of encap is then drained through peripheral ports and eventually ends up in a waste bottle.
JetEtch Head Design
The JetEtch incorporates, as standard a revolutionary etch assembly design, one that offers an interchangeable etch head.
The etch assembly now incorporates a replaceable etch head insert so that one can readily exchange inserts for different decapping requirements.
For example a conventional etch head insert is used for package opening to expose the die and first bond. In such a situation it is preferable to have a central and concentric dispersion of heated acid moving across the surface of the package. This concentric flow, coupled with vortex etching provides fast precise decapsulation.
If there is a requirement to examine peripheral components or large die in a package then it is easy to simply replace the etch head insert with a design providing peripheral acid flow. In this case the acid flow will be to the edge of the package with waste acid exiting via a central port.
Dependent on the etch volume necessary for large die exposure and also for some peripheral component exposure the JetEtch has an extended range of acid volume setting, up to a maximum of 5 ml/minute in 1 ml increments. Such a high volume, when coupled with vortex etching provides a very large range of acid digestion capabilities while continuing to optimize acid carrying capacities.
Concurrent Acid Mixing
To further optimize the decapsulation capabilities of these decapsulators, Nisene Technology Group has modified the pneumo-electric pump. The pump now has enhanced capabilities to mix etchants in real time. The turbo mixing that occurs within the volume of the pump itself eliminates the need for a mixing reservoir!
The elimination of the mix reservoir also enables the JetEtch to be used in a real time mode such that one can initiate a decap process with one acid etchant, stop the process and switch to a second acid or a mix. If necessary one can again switch to a third or even fourth mix ratio so that the operator has complete interactive control of every step of the etch process.
