"What is 'decapsulation' anyway?"

Decapsulation — in this context — is the technique developed by B&G International/Nisene Technology Group over 25 years ago that involves the removal of mold compound from an integrated circuit. This process is instrumental in the semiconductor's failure analysis industry. Our latest system developed for automated decapsulation, the JetEtch, is not only the world leader in decapsulator sales, but it the safest and most reputable product of its kind on the market.

Click here to read more about the JetEtch decapsulation system.