Nisene Technology Group - B&G International

World Leaders in Automated Decapsulator Technology, IC Delayering and Plastic Etching

Accessories

Nisene Technology Group offers the largest selection of accessories covering all standard packages. We also offer custom design services for nonstandard gaskets.

The following materials are available for download in PDF format from our Tech Bulletins page:
Bulletin Title
#2001 DIP Device Installation
#2002 Large DIP Device Installation
#2003 Small Quad Flat Pack (QFP) Installation
#2004 Large TQFP Installation
#2005 Small Outline Device Installation & Decapsulation of SOTs
#2006 Large SOIC Device Installation
#2007 BGA Device Installation
#2008 Die-Down BGA Device Installation
#2009 Fine Pitch Ball Grid Installation
#2010 PPGA Device Installation
#2011 Smart Card Installation