Nisene Technology Group - B&G International

World Leaders in Automated Decapsulator Technology, IC Delayering and Plastic Etching

Accessories

Nisene Technology Group offers the largest selection of accessories covering all standard packages. We also offer custom design services for nonstandard gaskets.

The following materials are available for download in PDF format from our Tech Bulletins page:
BulletinTitle
#2001DIP Device Installation
#2002Large DIP Device Installation
#2003Small Quad Flat Pack (QFP) Installation
#2004Large TQFP Installation
#2005Small Outline Device Installation & Decapsulation of SOTs
#2006Large SOIC Device Installation
#2007BGA Device Installation
#2008Die-Down BGA Device Installation
#2009Fine Pitch Ball Grid Installation
#2010PPGA Device Installation
#2011Smart Card Installation